OMRON Automation Introduces X-Ray Inspection Solution for Power Semiconductor Sector

17 Sep 2024

OMRON Automation highlighted its expertise in Surface Mount Technology (SMT) and Through-Hole Inspection solutions at Productronica India 2024. The display featured Automated X-Ray Inspection (AXI), Automated Optical Inspection (AOI), and Solder Paste Inspection (SPI) technologies.

A standout exhibit was the OMRON 3DCT AXI – X850, a cutting-edge solution designed for thorough inspection of power semiconductors. This advanced X-ray technology enables reliable detection of defects such as voids, insufficient solder, and misalignments, improving overall product reliability and consistency.

Sameer Gandhi, MD of OMRON Automation India, explained the importance of the solution, stating, “Semiconductor chips are vital for critical systems in electric vehicles (EVs), including battery management systems (BMS) and adaptive cruise control. As trends shift towards faster charging, miniaturization, and higher performance, there is a need for multi-layer products that require precise inspection to meet stringent quality standards, ensuring enhanced reliability and performance.”

The showcase also included AOI systems for accurate inspection of surface mount components, ensuring exceptional quality control in production, and SPI technology for precise solder paste inspection, which optimizes solder joint quality in electronics assembly.